Analysis of Failures of Embedded Mechatronic Systems, Volume 1: Predictive Reliability

In operation, mechatronics embedded systems are stressed by loads of different causes: climate (temperature, humidity), vibration, electrical and electromagnetic. These stresses in components which induce failure mechanisms should be identified and modeled for better control. AUDACE is a collaborative project of the cluster Mov'eo that address issues specific to mechatronic reliability embedded systems. AUDACE means analyzing the causes of failure of components of mechatronic systems onboard. The goal of the project is to optimize the design of mechatronic devices by reliability. The project brings together public sector laboratories that have expertise in analysis and modeling of failure, major groups of mechatronics (Valeo and Thales) in the automotive and aerospace and small and medium enterprises that have skills in characterization and validation tests This book helps you to: Find and develop ways to characterize and validate the design robustness and reliability of complex mechatronic devicesDevelop ways to characterize physical and chemical phenomenaIdentify mechanisms of failure of components of these devicesAnalyze the physical and chemical mechanisms of failure, in order of importanceModel failure mechanisms and design optimization INDICE: Chapter 1 Predictive Reliability of Embedded Electronic SystemsChapter2 Measuring Method of the Internal Temperature of Electronic Components Chapter 3 Dynamic Analysis of Mechatronic Components by Laser Vibrometry Chapter 4 Measurement of Static and Vibratory Deformations and Displacements by Full Field Methods Chapter 5 Characterization of the Electromagnetic Environment of Microwave Frequency Circuits Chapter 6 Characterization of the Behavior of Radiofrequency Power Transistors under Thermal and Electromagnetic StressesChapter7 Characterization of the Ability of Switching Transistors to Resist to Electrical OverstressChapter8 Spectroscopy of Non-destructive Characterizations of the Interface Physics of Mechatronics DevicesChapter 9 Study of the Dynamic Contact between Deformable Solids

• ISBN: 978-1-78548-013-3
• Editorial: Elsevier
• Encuadernacion: Cartoné
• Páginas: 250
• Fecha Publicación: 01/05/2015
• Nº Volúmenes: 1
• Idioma: Inglés