Thin Film Deposition by Magnetron Sputtering From Fundamentals to Applications

The proposed book deals with the fundamentals and the application of magnetron sputtering for different films like metals, hard coatings, optical layers and semiconductors with a special emphasis on the deposition of all films, used in thin film solar cells today. INDICE: 1)INTRODUCTION. 2)THE PRINCIPLE OF MAGNETRON SPUTTERING. 2.1 Historical Overview. 2.2. Basic Arrangements and Elements. 2.3. Comparison of Diode and Magnetron Sputtering. 2.4. Advantages and Disadvantages of Magnetron Sputtering. 3) PHYSICAL FOUNDATIONS. 3.1. Physics of Low Temperature Plasmas. 3.1.1. Plasmas. ?Classification of Plasmas. ?Characteristic Parameters of Plasmas. ?Interaction of the Plasma with Electrodes and Walls. ?Elementary Processes in Plasmas. ?Elementary Processes at Walls. ?Charge Carriers in Magnetic Fields. ?Generation of Plasmas. 3.1.2. Plasma Characterization. ?Discharge IV–Curves. ?Langmuir Probes. ?Mass Spectrometers. ?Energy Analyzers. ?Optical Plasma Monitors. ?Calorimetric Probes. 3.2.Physics of the Sputtering Process. 3.2.1.Collisional Process. 3.2.2.Sputtering Rate. ?Energy Dependence of the Sputtering Rate. ?Mass Dependence of the Sputtering Rate. ?Dependence of the Sputtering Rate from the Target Material. ?Sputtering of Alloys and Compounds. 3.2.3.Emission Distribution of Sputtered Particles. 3.2.4.Energy Distribution of Sputtered Particles. 3.2.5.Reactive Sputtering. ?Comparison of Nonreactive and Reactive Sputtering. ?Processes at the Target Surface. ?Processes at the Substrate Surface. ?Theoretical Description of the Reactive Sputtering. 3.3.Physics of the Deposition Process. 3.3.1.Layer Growth. ?Particle Flows to the Substrate. ?Sputtered Atoms. ?Sputtering Gas Atoms. ?Positive Ions. ?Negative Ions. ?Electrons. ?Photons. ?Nucleation. ?Layer Growth. ?Ion supported Growth. ?Radiation Damage –. Generation and Annealing. 3.3.2.Texturization and Epitaxy. 3.3.3.Growth of Compound Materials (Reactive Sputtering). 4) TECHNICAL REALIZATION . 4.1. Basic instrumentation of a magnetron sputtering system. 4.1.1. Basic Elements of a Magnetron Sputtering Source. 4.2. Types of Magnetron Sputtering Sources. 4.2.1.Hollow Cathode Sputtering Sources. 4.2.2.Planar Sputtering Sources. 4.2.3.Sputtering Sources with Locally Variable Magnetic Field. 4.2.4.Magnetron Sputtering Sources for High Pressures. 4.3. Examples of Magnetron Sputtering Systems. 4.4.Reactive Sputtering Systems. 4.5. Power Supplies for magnetron sputtering. 4.6.Typical Sputtering Process. 4.7.Technical Problems in Magnetron Sputtering. 5) APPLICATIONS OF THE MAGNETRON SPUTTERING. 5.1.Deposition of Conducting Layers (Metals). 5.2.Deposition Dielectric Layers (Insulators). 5.3.Deposition of Hard Coatings. 5.4.Deposition of magnetic films (hard discs). 5.5.Deposition of optical films (CDs, DVDs etc.). 5.6.Deposition of Semiconducting Layers. 6) TABLES AND FIGURES. 6.1.Secondary Electron Emission Coefficients. 6.2.Ionization Probabilities. 6.3.Sputtering Rates. 6.4.Optical Emission. 6.5.Characteristic Parameters of Typical Plasmas. . .

• ISBN: 978-3-527-41210-5
• Editorial: Wiley VCH
• Encuadernacion: Cartoné
• Páginas: 400
• Fecha Publicación: 04/02/2015
• Nº Volúmenes: 1
• Idioma: Inglés