Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.
- ISBN: 978-9-4017-7949-4
- Editorial: Springer
- Encuadernacion: Rústica
- Páginas: 280
- Fecha Publicación: 27/09/2016
- Nº Volúmenes: 1
- Idioma: Inglés