Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging. Provides a comprehensive summary of the most recent advances in materials development for advanced packaging Covers emerging technologies such as digital health, bio-medical, and nano-materials / processing, in addition to microelectronic and optoelectronic packaging Discusses various types of materials includingpolymers, ceramics, metals, and solders Each chapter written by industry leaders INDICE: Materials for 3D Packages.- Materials for Advanced Bonding/ Joining Techniques.- Materials for Advanced Interconnections.- Lead-Free Solders.- Materials for Wafer Processing (such as thinning).- Materials for Advanced Substrates (such as thin core or coreless substrates).- Materials for Advanced;Underfill and Encapsulant.- Adhesives(ECA, Nano-ECA, Die Attach Adhesive).- Advanced Thermal Interface Materials.- MAterials for Embedded Passives.- Nanomaterials/ Nanopackaging.- Wafer Level Packaging.- MEMS Packaging.- Optical Packaging.- Digital Health and Biomedical Packaging.
- ISBN: 978-0-387-78218-8
- Editorial: Springer
- Encuadernacion: Cartoné
- Páginas: 600
- Fecha Publicación: 01/08/2008
- Nº Volúmenes: 1
- Idioma: Inglés