This book describes the specific packaging and interconnect challenges involved in developing implantable microelectronic and MEMS devices for the brain and will explain a variety of the currently successful approaches. Significant, open problems will also be described, such as development of advanced materials, testing methodologies, and sensing and actuation technologies.
- ISBN: 978-1-4419-8519-4
- Editorial: Springer
- Encuadernacion: Cartoné
- Fecha Publicación: 21/10/2015
- Nº Volúmenes: 1
- Idioma: Inglés