Nanopackaging: nanotechnologies and electronics packaging

Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes.Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement. “Nanopackaging” is intended for industrial and academicresearchers, industrial electronics packaging engineers who need to keep abreast of their field, and others with interests in nanotechnology. It will survey the application of nanotechnologies to electronics packaging, as representedby current research across the field.

• ISBN: 978-1-4419-4290-6
• Editorial: Springer
• Encuadernacion: Rústica
• Páginas: 549
• Fecha Publicación: 01/10/2010
• Nº Volúmenes: 1
• Idioma: Inglés