‘Electrical Conductive Adhesives with Nanotechnologies’ begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs), Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can beapplied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability. Compares and contrasts lead-free soldering techniques and electrically conductive adhesives and discusses the advantages of electrically conductive adhesives Discusses isotropically conductive adhesives, anisotropically conductive adhesives/films, non-conductrice adhesives/films, their current applications, in industry, advantages and limitations, recent developments and nanotechnologyapplications INDICE: Introduction.- Electrically conductive adhesives categories.- Isotropically conductive adhesives.- Anisotropically conductive adhesives/films.- Non-donductric adhesives/films.- Nano-eca and future trends.
- ISBN: 978-0-387-88782-1
- Editorial: Springer
- Encuadernacion: Cartoné
- Páginas: 250
- Fecha Publicación: 01/10/2009
- Nº Volúmenes: 1
- Idioma: Inglés