Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturersPresents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniquesIncludes program files and macros for additional study INDICE: Temperature induced failure Moisture induced failure Mechanical shock induced failure Adhesive interconnects and viscoelasticity Concluding remarks Programs and macro files Temperature induced failure Moisture induced failure Mechanical induced failure

• ISBN: 978-1-84569-528-6
• Editorial: Woodhead Publishing
• Encuadernacion: Cartoné
• Páginas: 240
• Fecha Publicación: 01/06/2015
• Nº Volúmenes: 1
• Idioma: Inglés