Micro and nano mechanical testing of materials and devices
Yang, Fuqian
Li, James C.M.
Nanoscale and nanostructured materials have exhibited different physical properties from the corresponding macroscopic coarse-grained materials due to the size confinement. As a result, there is a need for new techniques to probe themechanical behavior of advanced materials on the small scales. Micro and NanoMechanical Testing of Materials and Devices presents the latest advances in the techniques of mechanical testing on the micro- and nanoscales, which are necessary for characterizing the mechanical properties of low-dimensional materials and structures. Written by a group of internationally recognized authors, this book covers topics such as: (1) Techniques for micro- and nano- mechanical characterization; (2) Size effects in the indentation plasticity; (3) Characterization of low-dimensional structure including nanobelts and nanotubes; (4)Characterization of smart materials, including piezoelectric materials and shape memory alloys; (5) Analysis and modeling of the deformation of carbon-nanotubes. Application of nanoindentation in the characterization of smart materials such as shape memory alloys and piezoelectric materials Characterization ofsmall-scale structure including nanobelts and electronic devices Characterization of biomaterials such as biomembrane Size-dependent mechanical behavior INDICE: Principles and applications of indentation.- Size effects in nanoindentation.- Indentation in shape memory alloys.- Adhesive contact of solid surfaces.- nanomechanical characterization of one-dimensional nanostructures.- Deformation behavior of nanoporous metals.- Residual stress determination usingnanoindentation technique.- Piezoelectric response in the contact deformationof piezoelectric materials.- Mechanics of carbon nanotubes and their composites.- Microbridge tests.- Nanoscale testing of one-dimensional nanostructures.-Metrologies for mechanical response of micro- and nanoscale systems.- Mechanical characterization of low dimensional structures through on-chip tests.
- ISBN: 978-0-387-78700-8
- Editorial: Springer
- Encuadernacion: Cartoné
- Páginas: 350
- Fecha Publicación: 01/08/2008
- Nº Volúmenes: 1
- Idioma: Inglés